"The decade-long partnership between Intel and Micron to build better NAND (or Flash) memory used in solid-state drives has yielded an entirely new form of computer memory. This is a big deal. It’s as if a 10-year effort by Ford and GM to build a better car also produced a Segway..." ~ "The two companies are calling their new memory 3D XPoint memory (pronounce 3D crosspoint memory) because its structure creates an lattice-like stacked layer of wires that looks like Xes when viewed from above. It combines properties of NAND Flash memory that is currently used inside solid state drives (SSDs) inside computers and phones, but it is 1,000 times faster and can last through 1,000 times more data writes..." Read More!
"Intel and Micron's joint venture IMFT has announced that it has produced a 128Gb die. A package combining eight such dies together would be small enough to fit on a fingertip and boast an unprecedented 128GB capacity. Mass production will start in the first half of next year, and devices using the new dies are likely to start shipping in 2013..."
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