City of Industry, January 12, 2010 - GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel® H55 and Intel® H57 chipset and leveraging the success of the GIGABYTE Ultra Durable™ 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6™ PC management tools, Dynamic Energy Saver™ 2 power saving utilities, DualBIOS™ and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.
“GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices,” commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. “Featuring next generation storage capabilities including USB 3.0* and high performance digital DisplayPort* connectivity, as well as GIGABYTE’s own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system.”
Supporting the latest Intel® Core™ i3 and Core™i5 LGA 1156 socket processors featuring the first on-die integrated graphics and DDR3 memory controller (codename Clarkdale), the GIGABYTE H55/H57 series motherboards provide exceptional high definition content playback unmatched by previous integrated graphic solutions. Making sure users have the very latest connectivity options, the GIGABYTE H55/H57 series support a wide range of display interfaces including VGA, DVI, HDMI and DisplayPort. For those wanting to push their graphics performance to even higher levels, the GIGABYTE H55/H57 series support overclocking of the GPU core frequency for a performance gain of up to 13%.
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