San Jose, California - August 26, 2009 - Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company's standard DDR3 DIMMs.
In this product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most PCBs are made of, and one-third less copper. These DIMMs have already been tested exhaustively with a variety of hardware and software to ensure they meet Super Talent's rigid quality standards, and are backed with Super Talent's lifetime warranty.
Super Talent also redesigned their package for these green DIMMs to use about half as much plastic in a clamshell that occupies 57% less volume. These reductions in material usage result in a packaged module that weighs 35% less than a standard DDR3 packaged DIMM, which translates to significant savings in shipping costs.
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